Download EBOOK Characterization of Integrated Circuit Packaging Materials PDF for free


Download EBOOK Characterization of Integrated Circuit Packaging Materials PDF for free Category: Technology & Engineering
The author of the book: Thomas M. Moore
Format files: PDF, EPUB, TXT, DOCX
The size of the: 6.35 MB
Language: English
ISBN-13: 9780750692670
Edition: Butterworth-Heinemann Ltd
Date of issue: 7 October 1993

Description of the book "Characterization of Integrated Circuit Packaging Materials":

Characterization of Integrated Circuit Packaging Materials deals with the systems of materials that comprise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniques appropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. This book discusses issues which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board, and multi-chip models.

Download EBOOK Characterization of Integrated Circuit Packaging Materials PDF for free


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Thomas M. Moore

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Download EBOOK Characterization of Integrated Circuit Packaging Materials PDF for free



Download EBOOK Characterization of Integrated Circuit Packaging Materials for free

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